ceramic plate series cp10 - 127 - 06 thermoelectric modules page 1 of 3 the ceramic plate (cp) series of thermoelectric modules (tems) is considered the standard in the thermoelectric industry. this broad product line of high - performance and highly reliable tems is available in numerous heat pumping capacities, geometric shapes, and input power ranges. assembled with bismuth telluride semiconductor material and thermally conductive aluminum oxide ceramics, the cp series is designed for higher curren t and large heat - pumping applications. americas: +1.919.597.7300 europe: +46.31.420530 asia: +86.755.2714.1166 ets.sales@lairdtech.com www.lairdtech.com features ? precise temperature control ? compact geometric s izes ? reliable solid state o peration ? no sound or v ibration ? environmentally f riendly ? dc o peration ? rohs compliant applications ? medical l asers ? lab s cience i n strumentation ? clinical diagnostics s ystems ? photonics laser systems ? electronic enclosure c ooling ? food & beverage c ooling ? chillers (l iquid c ooling ) specifications technical hot side temperature ( c) 25 c 50 c qmax (watts) 25 . 7 30 . 4 delta tmax (c) 6 8 75 imax (amps) 3. 0 3. 0 vmax (volts) 14. 5 16.4 module resistance (ohms) 0.84 0 . 95 suffix thickness (prior to tinning) flatness & parallelism hot face cold face lead length l 0.1 42 0.010 0.001 5/0.001 5 lapped lapped 4.5 l1 0.142 0.001 0.001/0.001 lapped lapped 4.5 l2 0.142 0.0005 0.0005/0.0005 lapped lapped 4.5 ml 0.1 44 0.010 0.002/0.002 metallized lapped 4.5 lm 0.144 0.010 0.002/0.002 lapped metallized 4.5 mm 0.1 48 0.010 0.002/0.002 metallized metallized 4.5 sealing options suffix sealant color temp range description rt rtv white - 60 to 204 c non - corrosive, silicone adhesive ep epoxy bla ck - 55 to 150 c low density syntactic foam epoxy encapsulant
cp10 - 127 - 0 6 page 2 of 3 performance curves at th =25c thermo electric
cp10 - 127 - 0 6 page 3 of 3 notes 1. max operating t emperature: 80 c 2. do not exceed imax or vmax when operating module 3 . reference assembly guidelines for recommended installation 4. solder tinning also available on metallized ceramics laird - ets - cp10 - 127 - 0 6 - data - sheet - 101416 any information furnished by laird technologies, inc. and its agents is believed to be accurate and reliable. all specificati ons are subject to change without notice. responsibility for the use an d application of laird technologies materials rests with the end user. laird technologies makes no warranties as to the fitness, merchantability, suitability or non - infringement of any laird technologies materials or products for any specific or general u ses. laird technologies shall not be liable for incidental or consequential damages of any kind. all laird technologies products are sold pursuant to the laird technologies terms and conditions of sale in effect from time to time, a copy of whi ch will be furnished upon request. ? copyright 2016 laird technologies, inc. all rights reserved. laird, laird technologies, the laird technologie s logo, and other marks are trademarks or registered trademarks of laird technologies, inc. or an affiliate company there of. other product or service names may be the property of third parties. nothing herein provides a license under any laird technologies or any third party intellect ual property rights.
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